Abstract
We have developed and proposed a model for reactive ion etching (RIE) process design of nickel oxide thin films using a computational materials design based on ab initio calculations. On etching NiO, we found that it was necessary to have hydrogen-based reactive gases in the initial state in order to enhance RIE (e.g.NH3, CH4). We strongly suggest the use of CH 4 or any H-based gas source other than CHF3 to enhance RIE process.
Original language | English |
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Article number | 365210 |
Number of pages | 7 |
Journal | Journal of Physics Condensed Matter |
Volume | 19 |
Issue number | 36 |
DOIs | |
Publication status | Published - 12 Sept 2007 |
Externally published | Yes |