Abstract
Device to monitor and control the temperature of electronic chips to enhance reliability including a thermal electric cooling device in which the cold side is thermally secured to the chip and the hot side is attached to a heat sink. A thermocouple is sandwiched between the TEC device and the chip and a feedback control circuit is connected between the thermocouple and the voltage source which applies a potential to the TEC device to maintain the chip at the desired substantially constant temperature.
| Original language | English |
|---|---|
| Patent number | US5569950 |
| Publication status | Published - 1996 |
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Cite this
Lewis, D., & Narayan, C. (1996). Device to monitor and control the temperature of electronic chips to enhance reliability [Expired]. (Patent No. US5569950). https://patents.google.com/patent/US5569950A