Device to monitor and control the temperature of electronic chips to enhance reliability [Expired]

David Lewis (Inventor), Chandrasekhar Narayan (Inventor)

    Research output: Patent

    Abstract

    Device to monitor and control the temperature of electronic chips to enhance reliability including a thermal electric cooling device in which the cold side is thermally secured to the chip and the hot side is attached to a heat sink. A thermocouple is sandwiched between the TEC device and the chip and a feedback control circuit is connected between the thermocouple and the voltage source which applies a potential to the TEC device to maintain the chip at the desired substantially constant temperature.
    Original languageEnglish
    Patent numberUS5569950
    Publication statusPublished - 1996

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