Large thermoelectric effects in p-SiC/p-Si and n-SiC/p-Si heterojunctions

Pablo Guzman, Toan Dinh, Thanh Nguyen, Abu Riduan Md Foisal, Hung Nguyen, Quan Nguyen, Tuan-Khoa Nguyen, Hoang-Phuong Phan, Philip Tanner, Peter Woodfield, Van Thanh Dau, Huaizhong Li, Nam-Trung Nguyen, Dzung Viet Dao

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

The thermoelectric effect is important for thermal sensing, energy harvesting and other applications. This paper investigates the Seebeck coefficient of silicon carbide (SiC) on silicon (Si) heterojunctions and discusses the mechanism underlying the observed effects. The measured Seebeck coefficients of p‐3C‐SiC/p‐Si and n‐3C‐SiC/p‐Si heterojunctions are much higher than other reported values for SiC materials. The maximum Seebeck coefficients of p‐3C‐SiC/p‐Si and n‐3C‐SiC/p‐Si obtained were 1720 µV/K at 383 K and –421 µV/K at 396 K, respectively. These values are almost three times higher than those of other p-SiC and n-SiC materials. The high Seebeck coefficient in SiC/Si heterojunctions is attributed to the unique structure of the heterojunctions, which enables thermally activated charge carriers to migrate from Si to SiC. The results suggest that these heterojunctions can be exploited to develop highly sensitive self-powered thermal sensors.

Original languageEnglish
Article number108493
Number of pages7
JournalMaterials Today Communications
Volume38
DOIs
Publication statusPublished - Mar 2024
Externally publishedYes

Keywords

  • Interface
  • Seebeck coefficient
  • Semiconductor material
  • SiC heterojunction

Fingerprint

Dive into the research topics of 'Large thermoelectric effects in p-SiC/p-Si and n-SiC/p-Si heterojunctions'. Together they form a unique fingerprint.

Cite this