TY - GEN
T1 - Low complex Hardware Architecture Design Methodology for Cubic Spline Interpolation Technique for Assistive Technologies
AU - Cheduluri, Ganesh
AU - Bhardwaj, Swati
AU - Naik, Ganesh R.
AU - Hansigida, Vidhumouli
AU - Nali, Appa Rao
AU - Acharyya, Amit
PY - 2022
Y1 - 2022
N2 - The Hardware implementation of the Empirical mode decomposition algorithm has attracted attention in recent years due to its data-driven nature, adaptability, and ability to process non-stationary and non-linear signal analysis. Due to its high computation requirements for the sifting process, it is difficult to achieve low hardware complexity. The proposed design introduces an efficient VLSI architecture for the Cubic spline interpolation technique based on the Co-Ordinate Rotation Digital Computer(CORDIC) for generating envelops in the EMD algorithm. The design was implemented on Xilinx ZynqU ltraScale+ZCU 102 Evaluation Board and synthesized using Vivado 2018.1 Design Suite with the fixed-point data format and generated envelops using the sifting procedure.
AB - The Hardware implementation of the Empirical mode decomposition algorithm has attracted attention in recent years due to its data-driven nature, adaptability, and ability to process non-stationary and non-linear signal analysis. Due to its high computation requirements for the sifting process, it is difficult to achieve low hardware complexity. The proposed design introduces an efficient VLSI architecture for the Cubic spline interpolation technique based on the Co-Ordinate Rotation Digital Computer(CORDIC) for generating envelops in the EMD algorithm. The design was implemented on Xilinx ZynqU ltraScale+ZCU 102 Evaluation Board and synthesized using Vivado 2018.1 Design Suite with the fixed-point data format and generated envelops using the sifting procedure.
KW - Co-ordinate Rotation Digital Computer(CORDIC)
KW - Cubic Spline Interpolation
KW - Empirical Mode Decomposition
KW - Intrinsic Mode Function
KW - Surface EMG signal
KW - Tridiagonal Matrix Algorithm
UR - http://www.scopus.com/inward/record.url?scp=85138709805&partnerID=8YFLogxK
U2 - 10.1109/NEWCAS52662.2022.9842110
DO - 10.1109/NEWCAS52662.2022.9842110
M3 - Conference contribution
AN - SCOPUS:85138709805
T3 - 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings
SP - 70
EP - 74
BT - 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings
PB - Institute of Electrical and Electronics Engineers
CY - USA
T2 - 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022
Y2 - 19 June 2022 through 22 June 2022
ER -