Message from the IEEE ISPA 2021 Program Chairs

Alam Zakirul Alam; Alireza Jolfaei; Qiu Han Qiu

doi:10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006

Message from the IEEE ISPA 2021 Program Chairs

Alam Zakirul Alam, Alireza Jolfaei, Qiu Han Qiu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.

Original language	English
Title of host publication	ISPA 2021
Subtitle of host publication	International Symposium on Parallel and Distributed Processing with Applications
Publisher	Institute of Electrical and Electronics Engineers
Pages	xlii
Number of pages	1
DOIs	https://doi.org/10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006
Publication status	Published - 2021
Externally published	Yes
Event	ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications - New York City, NY., United States Duration: 30 Sept 2021 → 3 Oct 2021 Conference number: 19 https://ieeexplore.ieee.org/xpl/conhome/9644634/proceeding

Publication series

Name	ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications
Publisher	IEEE

Conference

Conference	ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications
Country/Territory	United States
City	New York City, NY.
Period	30/09/21 → 3/10/21
Internet address	https://ieeexplore.ieee.org/xpl/conhome/9644634/proceeding

Keywords

Conference
Welcoming address
IEEE

Access to Document

10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006Licence: In Copyright

Cite this

Zakirul Alam, A., Jolfaei, A., & Han Qiu, Q. (2021). Message from the IEEE ISPA 2021 Program Chairs. In ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications (pp. xlii). (ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006

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title = "Message from the IEEE ISPA 2021 Program Chairs",

abstract = "Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.",

keywords = "Conference, Welcoming address, IEEE",

author = "{Zakirul Alam}, Alam and Alireza Jolfaei and {Han Qiu}, Qiu",

year = "2021",

doi = "10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006",

language = "English",

series = "ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications",

publisher = "Institute of Electrical and Electronics Engineers",

pages = "xlii",

booktitle = "ISPA 2021",

address = "United States",

note = "ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications ; Conference date: 30-09-2021 Through 03-10-2021",

url = "https://ieeexplore.ieee.org/xpl/conhome/9644634/proceeding",

}

Zakirul Alam, A, Jolfaei, A & Han Qiu, Q 2021, Message from the IEEE ISPA 2021 Program Chairs. in ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications. ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications, Institute of Electrical and Electronics Engineers, pp. xlii, ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications, New York City, NY., United States, 30/09/21. https://doi.org/10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006

Message from the IEEE ISPA 2021 Program Chairs. / Zakirul Alam, Alam; Jolfaei, Alireza; Han Qiu, Qiu.
ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications. Institute of Electrical and Electronics Engineers, 2021. p. xlii (ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Message from the IEEE ISPA 2021 Program Chairs

AU - Zakirul Alam, Alam

AU - Jolfaei, Alireza

AU - Han Qiu, Qiu

N1 - Conference code: 19

PY - 2021

Y1 - 2021

N2 - Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.

AB - Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.

KW - Conference

KW - Welcoming address

KW - IEEE

UR - http://www.scopus.com/inward/record.url?scp=85124160034&partnerID=8YFLogxK

U2 - 10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006

DO - 10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006

M3 - Conference contribution

AN - SCOPUS:85124160034

T3 - ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications

SP - xlii

BT - ISPA 2021

PB - Institute of Electrical and Electronics Engineers

T2 - ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications

Y2 - 30 September 2021 through 3 October 2021

ER -

Zakirul Alam A, Jolfaei A, Han Qiu Q. Message from the IEEE ISPA 2021 Program Chairs. In ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications. Institute of Electrical and Electronics Engineers. 2021. p. xlii. (ISPA 2021: International Symposium on Parallel and Distributed Processing with Applications). doi: 10.1109/ISPA-BDCloud-SocialCom-SustainCom52081.2021.00006

Message from the IEEE ISPA 2021 Program Chairs

Abstract

Publication series

Conference

Keywords

Access to Document

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