@inproceedings{e71840bc5fa342559f56d7aa1b1d059f,
title = "Seebeck coefficient in SiC/Si heterojunction for self-powered thermal sensor",
abstract = "Development of new materials with high thermoelectric coefficient will expand the capability of thermoelectric sensors. In this work, we investigate the thermoelectric properties of silicon carbide (SiC) on silicon (Si) heterojunction towards self-powered temperature sensing applications. A SiC/Si heterojunction device was designed and fabricated to measure the Seebeck coefficient. The device showed a high Seebeck coefficient of -156.11 V at 336 K, which progressively increased with increasing temperature and reached -374.78 V at 383 K. These thermoelectric characteristics indicate superior result compared to previous polycrystalline and monocrystalline SiC thin films. The innovative heterojunction demonstrated in this work holds promises for developing highly sensitive self-powered thermal sensors.",
keywords = "heterojunction, Seebeck coefficient, self-powered thermal sensors, Silicon Carbide",
author = "Pablo Guzman and Toan Dinh and Thanh Nguyen and Dau, \{Van Thanh\} and Foisal, \{Abu Riduan Md\} and Hung Nguyen and Hieu Vu and Tuan-Khoa Nguyen and Hoang-Phuong Phan and Huaizong Li and Nam-Trung Nguyen and Dao, \{Dzung Viet\}",
year = "2021",
doi = "10.1109/SENSORS47087.2021.9639762",
language = "English",
isbn = "9781728195025",
series = "Proceedings of IEEE Sensors",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2021 IEEE Sensors, SENSORS 2021 - Conference Proceedings",
address = "United States",
note = "20th IEEE Sensors, SENSORS 2021 ; Conference date: 31-10-2021 Through 04-11-2021",
}