Understanding meso interfacial structures between z-pins and laminates in z-pinned laminates

Xiaoxu Wang, Wen Chen, Youhong Tang

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


Z-pin pull-out tests from the laminates were conducted to explain the components of the meso interface structure of z-pin/laminate and the debonding position. Three types of z-pins with different molding qualities were investigated. The results revealed that the z-pin/laminate interface was composed of two meso interface components connected in series, including the interface between the outer layer resin of z-pin and the resin of laminate (Interface Ⅰ) and the interface between z-pin's own fiber and its own matrix resin (Interface Ⅱ). Debonding would occur at the weaker one. The z-pin with the best molding quality possessed the highest interfacial bond shear stress, τd, and the debonding mainly occurred at Interface Ⅰ. Regarding the z-pin with the worst molding quality, its τd was the lower one and the debonding primarily occurred at Interface Ⅱ. While this kind of z-pin exhibited the higher resistance at the final frictional pull-out stage.

Original languageEnglish
Article number101313
Number of pages4
JournalComposites Communications
Publication statusPublished - Nov 2022

Bibliographical note

Publisher Copyright:
© 2022


  • Interface
  • Laminates
  • Meso structure
  • Z-pins


Dive into the research topics of 'Understanding meso interfacial structures between z-pins and laminates in z-pinned laminates'. Together they form a unique fingerprint.

Cite this